Dow silicone 10 to 1 encapsulants are supplied as two-part liquid component kits. When liquid components are thoroughly mixed, the mixture cures to a flexible elastomer, which is well suited for the protection of electrical/PCB system assembly applications. Dow silicone encapsulants cure without exotherm at a constant rate regardless of sectional thickness or degree of confinement.o-part, clear, 10:1, RT and heat cure, good strength, UL and Mil Spec, same as SYLGARD™ 182 but with faster RT cure.
- TECHNICAL SPECIFICATIONS
| Typical Properties | |
| Color | Transparent Colorless |
| Cure Characteristics | Heat Cure >100C |
| Cure Type | Addition Cure |
| Dielectric Constant at 100 Hz | 2.72 |
| Dielectric Constant at 100 kHz | 2.68 |
| Dielectric Strength | 500 volts per mil v/mil |
| Dissipation Factor at 100 Hz | 0.00257 |
| Dissipation Factor at 100 kHz | < 0.00133 |
| Durometer – Shore A | 43 Shore A |
| Durometer / Hardness | Medium Stiffness 20A-50A |
| Dynamic Viscosity | 3500 Centipoise |
| Flowable | Yes |
| Heat Cure | 10 Minutes @ 150 Deg C, 20 Minutes @ 125 Deg C, 35 Minutes @ 100 Deg C |
| Hydrophobic | Yes |
| Low Odor | Yes |
| Mix Ratio | 10:1 Base to Catalyst 87-RC |
| Number of Parts | Two |
| One or Two Part | Two Part |
| Polyesters | Yes |
| Product Groups for Display / Optical | Encapsulant / Gel |
| Resistance Type | Oxidation Resistance, Ozone Resistance, Thermal Resistance, UV Resistance, Water Resistance |
| Room Temperature Cure – Hours | 48 Hours |
| Self Leveling | Yes |
| Shelf Life | 720 Days |
| Solventless | Yes |
| Special Characteristics | MIL Spec, UL Recognized |
| Specific Gravity @ 25°C | 1.03 |
| Temperature Range | -45 to 200 °C |
| Temperature Stable | High, Low |
| Thermal Conductivity | 0.27 W/m・K |
| Thermosetting | Yes |
| UL 94 V-0 @ 8.4 mm thickness | Yes |
| UL 94 V-1 @ 6.0 mm thickness | Yes |
| Viscosity / Flow | Controlled Flow 2000 – 20,000 cps |
| Volume Resistivity | 2.9e+014 Ω・cm |
| Water Resistant | Yes |
| Working Time | > 90 Minutes |
- PURCHASING GUIDE
